Now Published    Volume 4 Applications of Vibrational Spectroscopy in Industry, Materials and the Physical Sciences A. Ameri, University of Essen, Essen, Germany J. L. Armstrong, Intel Corp, Hillsboro, OR, USA L. Avila, Columbia University, New York, NY, USA S. J. Barlow, The University of Nottingham, Nottingham, UK E. G. Bartick, FBI Academy, Quantico, VA, USA I. T. Bertschi, University of Montana, Missoula, MN, USA T. E. Bitterwolf, University of Idaho, Moscow, ID, USA F. J. Boerio, University of Cincinnati, Cincinnati, OH, USA L. Bokobza, ESPCI, Paris Cedex, France S. Bordiag, IFM dell'Università di Torino, Torino, Italy C. Carr, The Paint Research Association, Teddington, UK R. O. Carter III, Ford Research Laboratory, Dearborn, MI, USA J. M. Chalmers, The University of Nottingham, Nottingham, UK P. Chauvel, The Dow Chemical Company, Freeport, TX, USA A. R. Chughtai, University of Denver, Denver, CO, USA R. J. H. Clark, University College London, London, UK I. Clegg, ICI Eutech, Runcorn, UK K. Cole, National Research Council, Boucherville, Canada R. J. Combs, US Army, SBCCOM, Aberdeen Proving Ground, MD, USA J. N. Cox, Lake Oswego, OR, USA M. A. Czarnecki, University of Wroclaw, Wroclaw, Poland M. Daturi, ISMRA, Caen Cedex, France C. De La Cruz, La Universidad del Zulia, Maracaibo, Venezuela G. Dent, Avecia Ltd, Blackley, UK N. J. Everall, ICI plc, Wilton, Middlesbrough, UK L. Fine, Columbia University, New York, NY, USA Y. Furukawa, Waseda University, Tokyo, Japan J-L. Gardette, Université Blaise Pascal (Clermont-Ferrand), Aubiere Cedex, France M. W. George, The University of Nottingham, Nottingham, UK P. Gillet, Ecole Normale Supérieure de Lyon, Lyon cedex, France V. G. Gregoriou, Polaroid Corporation, Waltham, MA, USA D. W. T. Griffith, University of Wollongong, Wollongong, NSW, Australia J. Grimblot, Université des Sciences et Technologies de Lille, Villeneuve d'Ascq Cedex, France R. Guenard, The Dow Chemical Company, Freeport, TX, USA H. Harima, Osaka University, Osaka, Japan R. Harner, The Dow Chemical Company, Midland, MI, USA U. Hoffmann, University of Essen, Essen, Germany P. Hollins, University of Reading, Reading, UK C. T. Johnston, Purdue University, West Lafayette, IN, USA G. Kaczmarczyk, Technischen Universität Berlin, Berlin, Germany A. K. Kalkar, University of Mumbai, Matunga, Mumbai, India K. Kawaguchi, Okayama University, Okayama, Japan S. A. Kennedy, University of Reading, Reading, UK B. King, formerly of ICI Eutech, Runcorn, UK C. Korzeniewski, Texas Tech University, Lubbock, TX, USA R. T. Kroutil, US Army, SBCCOM, Aberdeen Proving Ground, MD, USA J. C. Lavalley, ISMRA, Caen Cedex, France D. F. Leclerc, Pulp and Paper Research Institute of Canada, Vancouver, Canada C. Marcott, The Procter & Gamble Company, Cincinnati, OH, USA F. Mauge, ISMRA, Caen Cedex, France K. L. McNesby, US Army Research Laboratory, Aberdeen Proving Ground, MD, USA J. W. Medernach, SiCASA, Inc., Albuquerque, NM, USA S. Michel, University of Essen, Essen, Germany S-i. Nakashima, Miyazaki University, Miyazaki, Japan H. Neff, Lewis-Clark State College, Lewiston, ID, USA I. Noda, The Procter & Gamble Company, Cincinnati, OH, USA F. Papini, Université d'Aix-Marseille I, Marseille Cedex, France M. Papini, Université d'Aix-Marseille I, Marseille Cedex, France E. Payen, Université des Sciences et Technologies de Lille, Villeneuve d'Ascq Cedex, France J. E. Pemberton, University of Arizona, Tucson, AZ, USA R. A. Pesce-Rodriguez, US Army Research Laboratory, Aberdeen Proving Ground, MD, USA F. Pfeifer, University of Essen, Essen, Germany C. Pharr, Lewis-Clark State College, Lewiston, ID, USA M. Poliakoff, The University of Nottingham, Nottingham, UK S. E. Rodman, Polaroid Corporation, Waltham, MA, USA H. W. Siesler, University of Essen, Essen, Germany G. W. Small, Ohio University, Athens, OH, USA D. M. Smith, University of Denver, Denver, CO, USA G. Spoto, IFM dell'Università di Torino, Torino, Italy A. Sullivan, Lewis-Clark State College, Lewiston, ID, USA K. Tashiro, Osaka University, Osaka, Japan J. D. Tate, The Dow Chemical Company, Freeport, TX, USA C. Thomsen, Technischen Universität Berlin, Berlin, Germany S. Tiegs, Lewis-Clark State College, Lewiston, ID, USA T. P. Trung, Pulp and Paper Research Institute of Canada, Vancouver, Canada D. D. Turner, Pacific Northwest National Laboratory, Richland, WA, USA S-L. Wang, Purdue University, West Lafayette, IN, USA W. H. Weber, Ford Research Laboratory, Dearborn, MI, USA D. N. Whiteman, NASA Goddard Space Flight Center, Greenbelt, MD, USA R. J. Yokelson, University of Montana, Missoula, MN, USA M. Yoshikawa, Toray Research Center Inc., Shiga, Japan I. Zebger, University of Essen, Essen, Germany A. Zecchina, IFM dell'Università di Torino, Torino, Italy